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XB-MUSB-5B-C3SERIES| Product ID | Product Image | Product Description | Product Code | Production status | Shipping Cycle | Gross item weight | MPQ | MOQ | Production in transit | Competitive purchases | Operation |
XB-MUSB-5B-C3SERIES  3D
 Drawings |
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9 * 7.7 * 3.9mm USB socket B-type, sink plate H: 2.2mm Mini USB socket sink plate H: 2.2mm/SMD USB female socket sink plate H: 2.2mm/On board SMD USB interface sink plate/USB connector sink plate SMD | MINI USB connector 5P | Normal | 5-8 days | 0.000 | 500 PCS | 50000 PCS | 10000 |  Compatible Xibang |
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| XB-MUSB-5B-C3SERIES-X 3D
Drawings |
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9x7.7x3.9mm USB female socket B-type, sink plate H: 2.2mm Mini USB interface sink plate H: 2.2mm/SMT SMT SMT USB socket sink plate H: 2.2mm/On board SMT USB socket sink plate/USB socket sink plate SMD | MINI USB connector 5P | Normal | 5-8 days | 0.000 | 500 PCS | 50000 PCS | 10000 | Compatible Xibang |
| Product material | 1.Mini USB socket for 2.0 | material quality |
| 2. Contact terminal | yellow metal | |
| 3. Metal shell | Brass silver plated | |
| 4. Rubber shell shell | LCP/PBT UL94V-0 | |
| Product type features | Type of connector: | The mother end |
| direction: | right angle | |
| Connector system: | Cable to board | |
| Sealable: | yes | |
| Connector and terminal are terminated to: | printed circuit board | |
| Colour of glue core | Black / white | |
| Number of ports: | 1 | |
| End-connection features | Terminal terminal type: | Surface mount / plug-in |
| PCB termination method: | Surface mount / insertion | |
| Contact features | Terminal rated current (maximum value) (A): | 1A/ 2A 12A 30V DC |
| machine accessory | installation site: | Intermediate installation |
| PCB Installation fixed type: | Welding wire / welding plate | |
| Connector installation type: | Board installation | |
| service environment | Welding temperature (max.): | 260°C |
| preheat temperature | 150~200°C | |
| Plug-in period (max.): | 1500 | |
| Group temperature range: | -40°C±85°C | |
| Operation / application | Be able to pick up: | deny |
| Circuit application: | Power supply and signal | |
| Packaging characteristics | Packaging method (patch SMD): | Roll / package |
| Packaging method (plug-in DIP): | Plastic suction / packaging | |
| Welding experiment | Dip the terminal foot in the flux for 5 seconds, then immerse the terminal foot in a 245 ± 5℃ tin furnace for 3 ± 0.5 seconds | The tin attached area shall exceed 95% of the immersion surface area |
| Reflow welding and wave crest welding experiments | wave-soldering | The recommended solder temperature is 260℃ (500°F) for a maximum of 5 seconds |
| Hand welding | The 30W flipping iron is used to control the temperature at 350℃, and the welding time is about 5 seconds | |
| Back furnace welding | The maximum temperature of SMT backwelding furnace is 260℃ and the temperature is 260℃, the maximum time shall not exceed 10 seconds | |
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