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XB-DIN-G-11P| Product ID | Product Image | Product Description | Product Code | Production status | Shipping Cycle | Gross item weight | MPQ | MOQ | Production in transit | Competitive purchases | Operation |
XB-DIN-G-11P  3D
 Drawings |
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9.2 * 13.3mm DIN connector/BMW head socket/BMW head seat/11P terminal male seat/11P male head/11PIN plug | Normal | 1-2 weeks | 0.3g | 1000 pieces/bag | 5000 | 10000 |  Compatible Xibang |
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| XB-DIN-G-11P-X 3D
Drawings |
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9.2 * 13.3mm DIN connector/BMW head socket/BMW head seat/11P terminal male seat/11P male head/11PIN plug | Normal | 1-2 weeks | 0.3g | 1000 pieces/bag | 5000 | 10000 | Compatible Xibang |
| product material | 1. DIN connector | material |
| 2. Plastic | PBT | |
| 3. Shell | PBT | |
| 6. Terminal | Brass/Silver Plated/Gold Plated | |
| Operating temperature range | -20°C±70°C | |
| Maximum rating (resistive load) | 4A 30V DC | |
| Minimum rating (resistive load) | 2A 12V DC | |
| electrical properties | withstand voltage | 300V AC |
| Insulation resistance | 100mΩmax | |
| Insertion force | 25N~45N | |
| Contact resistance | 30mΩmax | |
| Durability | no load life | 5000 times |
| load life | 5000 times | |
| Environmental resistance | Cold resistance | -40±3℃ for 96h |
| Heat resistance | 80±2℃ for 96h | |
| Humidity resistance | 40±2℃, 90 to 95%RH for 96h | |
| 1. Temperature change experiment | According to the figure below, after 5 cycles, the test is carried out after 30 minutes under normal conditions. | |
| 3. Temperature distribution |
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| When hand soldering | soldering temperature | 260°C max. |
| Preheat time | 60 seconds maximum | |
| Continuous immersion time | 3 seconds maximum | |
| Welding times | 1 | |
| Durability | ||
| Solderability Test | The top of the terminal is immersed in the solder pool to a depth of 2mm at a temperature of 250±5°C for 3 seconds | More than 95% of the surface of the immersed part will be covered by tin |
| Lead-free tin test composition: tin 96.5% copper 3% silver 0.5% | ||
| Solder resistance test | When hand soldering, the temperature should be controlled at 300±5°, and the time should be 3±0.5s, but abnormal pressure should not be applied to the terminals | The body has no deformation and can meet the mechanical and electrical performance |
| Lead-free tin test composition: tin 96.5% copper 3% silver 0.5% | ||
| Corrugated welding | When using a low-wave oven for soldering, the maximum temperature setting is 260°C | |
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| Preheating temperature: The ambient temperature of the soldering surface of the PC board is up to 100°C | No damage to appearance or mechanical function | |
| Warm-up time: up to 60 seconds | ||
| Soldering temperature: up to 235°C | ||
| Continuous dipping time: up to 3 seconds | ||
| Number of welds: up to 1 time | ||
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