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XB-0403FSV19-XXXXX01| Product ID | Product Image | Product Description | Product Code | Production status | Shipping Cycle | Gross item weight | MPQ | MOQ | Production in transit | Competitive purchases | Operation |
XB-0403FSV19-XXXXX01  3D
 Drawings |
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BTB connector/vertical double row board to board socket/BTB socket SMT/board to board female socket/BTB connector spacing: 0.4mm/board to board connector 10PIN~120PIN | Normal | 1-2 weeks | 0.3g | 1000 PCS/disc | 5000 PCS | 10000 |  Compatible Xibang |
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| XB-0403FSV19-XXXXX01-X 3D
Drawings |
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BTB connector/vertical double row board to board socket/BTB socket SMT/board to board female socket/BTB connector spacing: 0.4mm/board to board connector 10PIN~120PIN | Normal | 1-2 weeks | 0.3g | 1000 PCS/disc | 5000 PCS | 10000 | Compatible Xibang |
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| XB-0403FSV19-XXXXX01-X-X 3D
Drawings |
  |
BTB connector/vertical double row board to board socket/BTB socket SMT/board to board female socket/BTB connector spacing: 0.4mm/board to board connector 10PIN~120PIN | Normal | 1-2 weeks | 0.3g | 1000 PCS/disc | 5000 PCS | 10000 | Compatible Xibang |
| Product material | 1. BTB Board to Board Connector | material quality |
| 2. The shell | PA9T UL94V-0 | |
| 3. Terminal | Brass Gold plated | |
| Product type features | rated current | 0.3A/0.5A AC |
| rated voltage | 30V/60V AC | |
| operating temperature range | -55℃～+125℃ | |
| Storage temperature range | -55℃～+125℃ | |
| contact resistance | 30mΩ≥90mΩ | |
| insulation resistance | 100 mΩ | |
| withstand voltage | 150V AC | |
| Environmental resistance | Cold resistance | -25±2℃ 96/h |
| resistance to effect of heat | 85 ± 2 ℃ 96/h | |
| Moisture resistance | 40 ± 2℃ relative humidity 90~95% 96 / h | |
| machine accessory | way to install | soldering-block |
| Connector installation type: | Board installation | |
| Packaging characteristics | Packaging method (patch SMD): | braid |
| Welding experiment | Dip the terminal foot in the flux for 5 seconds, then immerse the terminal foot in a 255 ± 5℃ tin furnace for 3 ± 0.5 seconds | The tin attached area shall exceed 95% of the immersion surface area |
| Heat resistance of welding tin | The terminals shall be tested for tin resistance under the following conditions, and test the contact impedance after solder heat resistance | |
| Electric soldering iron: 2 times | No cracks, scratches, and breaks | |
| temperature:≤350℃ | ||
| Time: 5s + / -1s | ||
| Reflow welding and wave crest welding experiments | wave-soldering | The recommended solder temperature is 260℃ (500°F) for a maximum of 5 seconds |
| Hand welding | The 30W flipping iron is used to control the temperature at 350℃, and the welding time is about 5 seconds | |
| Back furnace welding | The maximum temperature of SMT backwelding furnace is 260℃ and the temperature is 260℃, the maximum time shall not exceed 10 seconds | |
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