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XB-SUA-110PS-30| Product ID | Product Image | Product Description | Product Code | Production status | Shipping Cycle | Gross item weight | MPQ | MOQ | Production in transit | Competitive purchases | Operation |
XB-SUA-110PS-30  3D
 Drawings |
  |
23.6 * 5.12 * 14.19mm vertical USB3.0 socket/USB3.0 interface/USB 3.0 side plug socket/flat USB3.0 connector 9PIN | Normal | 1-2 weeks | 0.6 | 1000 | 50000 | 2000 |  Compatible Xibang |
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| XB-SUA-110PS-30-X 3D
Drawings |
  |
23.6 * 5.12 * 14.19mm vertical USB3.0 socket/USB3.0 interface/USB 3.0 side plug socket/flat USB3.0 connector 9PIN | Normal | 1-2 weeks | 0.6 | 1000 | 50000 | 2000 | Compatible Xibang |
| Product material | 1.USB socket for 3.0 | material quality |
| 2. Contact terminal | yellow metal | |
| 3. Metal shell | Brass silver plated | |
| 4. Rubber shell shell | PBT UL94V-0 | |
| Product type features | Connector type: | The mother end |
| direction: | right angle | |
| Connector system: | Cable to board | |
| Sealable: | yes | |
| Connector and terminal are terminated to: | printed circuit board | |
| Colour of glue core | Black / white | |
| Number of ports: | 1 | |
| End-connection features | Terminal-terminal type: | Surface mount / plug-in |
| PCB termination method: | Surface mount / insertion | |
| Contact features | Terminal rated current (maximum value) (A): | 1.5A/3A |
| machine accessory | installation site: | Intermediate installation |
| PCB installation fixed type: | Welding wire / welding plate | |
| Connector installation type: | Board installation | |
| service environment | Welding temperature (max. value): | 260°C |
| Plug-in period (max.): | 1500 | |
| Group temperature range: | -25°C±85°C | |
| Operation / application | Be able to pick up: | deny |
| Circuit application: | Power supply and signal | |
| Lead-free reflux section requirements: | ||
| parameter | consult | specifications |
| Average temperature gradient during preheating | 2.5°C/s | |
| soak period | soak | 2-3 Minutes |
| Time above 217°C | t1 | 60 Seconds |
| Time above 230°C | t2 | 50 Seconds |
| Time above 250°C | t3 | 5 Seconds |
| Reflux peak temperature | T peak value | 255°C (–0/+5°C) |
| The temperature gradient during cooling | Up to-5°C / s | |
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| This profile is the minimum requirement for assessing the aging resistance of the component. The heat transfer method used in reflux welding is hot air convection. The actual air temperature used to achieve the specified profile is high and largely depends on the reflux equipment. | ||
| Packaging characteristics | Packaging method (patch SMD): | Roll / package |
| Packaging method (plug-in DIP): | Plastic suction / packaging | |
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